QIAN Chenguang¹，TAN Qi^2,3，LI Chunquan¹，ZHENG Shuilin¹，SUN Zhiming¹

(1.School of Chemistry and Environmental Engineering,China University of Mining and Technology (Beijing),Beijing 100083，China; 2.Zhengzhou Institute of Multipurpose Utilization of Mineral Resources,CAGS,Zhengzhou 450006，China; 3.National Engineering Research Center for Multipurpose Utilization of Nonmetallic Mineral Resources,Zhengzhou 450006，China)

Abstract:In this paper,the raw material characteristics,modification process,surface modification method and selection of modifier,modifier dosage,modification process conditions of silicon micropowders were summarized.The methods of organic modification,inorganic modification and mechanochemical modification on the surface of silicon micropowders were mainly described.The modification mechanism of silane coupling agent and titanate coupling agent was given.The application of modified silicon micropowders in the fields of copper clad plate,rubber,coating,epoxy plastic sealing material and electrical insulating material was summarized.It is indicated that the raw material quality,modification method and modification condition affect the surface modification effect of silicon micropowders,and the combination of organic modification and other modification methods can be considered for composite modification.In addition,in order to give full play to the synergistic effect of modifiers,novel special modifiers should be selected or developed based on the properties of downstream substrates,and the modification mechanism of modifiers should be further studied,which will be the main research direction in the field of the surface modification of silicon micropowders in the future.The application research of silicon micropowders is mainly focused on the production of high-frequency copper cladding plate,high-level coatings,high-performance adhesives,insulation materials and other high-tech fields using spherical silicon micropowders as raw material.Refinement and functionalization of silicon micropowder will be the mainstream direction of application in the future.

Keywords:silicon micropower;surface modification;silane coupling agent;modification mechanism

中图分类号： TD985                            文献标志码：A

文章编号：1008-5548(2022)05-0001-10

DOI:10.13732/j.issn.1008-5548.2022.05.001

收稿日期： 2022-05-01， 修回日期：2022-05-05，在线出版时间：2022-07-05 09:25。

基金项目：中国地质调查局地质调查项目，编号：DD20221698。

第一作者简介：钱晨光(1996—)，男，硕士研究生，研究方向为粉体表面改性。E-mail：QCG15539100676@163.com。

通信作者简介：

郑水林(1956—)，男，教授，博士，博士生导师，研究方向为非金属矿物材料。E-mail：zhengsl@cumtb.edu.cn。

孙志明(1986—)，男，教授，博士，博士生导师，研究方向为非金属矿物材料。E-mail：zhimingsun@cumtb.edu.cn。