ISSN 1008-5548

CN 37-1316/TU

Journal Online  2021 Vol.27
<Go BackNo.6

Action mechanism of H+ and granite residue

YUAN Ye1,HUANG Junjun1,GUI Chengmei2,ZHANG Ningkun1,QIN Guangchao1,LI Qihong3,LI Peng4,ZHANG Xingfei5

(1. College of Energy Materials and Chemical Engineering, Hefei University, Hefei 230601, China;2.College of Chemical and Material Engineering, Chaohu University, Hefei 238000, China; 3. Kelong Powder Co. Ltd,Hezhou 542808, China; 4. College of Energy Materials and Chemical Engineering, Hezhou University, Hezhou 542899, China;5. Hezhou Longyuan New Material Co. Ltd, Hezhou 542800, China)

Abstract: This paper uses hydrochloric acid to treat artificial granite waste residue. With the help of electron microscopy, X-ray diffractometry, infrared spectrometer and other analytical means, the influence of different reaction time on the surface structure, composition and morphology of artificial granite waste residue was explored. The results show that the process of acid etching includes defect formation (selective dissolution) and defect disappearance (total dissolution) in dolomite and calcite crystals, and the reaction rate decreases gradually with the increase of reaction time.Firstly, H+ reacts with the (104) crystal plane of calcite, then with the (110) crystal plane of dolomite and then with the (110) crystal plane of calcite, and gradually forms a pore structure on the surface of the granite residue. The total specific surface area of the granite residue increases from 4.707 m2/g to 79.003 m2/g, and the maximum specific pore volume increases from 1.41 mm3/g to 9.2 mm3/g.

Keywords: granite residue; acid treatment; calcium carbonate; reaction mechanism

中图分类号: TQ132.32

文献标志码:A

文章编号:1008-5548(2021)06-0098-07

DOI:10.13732/j.issn.1008-5548.2021.06.012

收稿日期: 2021-03-30,修回日期:2021-06-25,在线出版时间:2021-10-19 08:52。

基金项目:合肥学院人才基金项目,编号:18-19RC18;广西重点研发计划项目,编号:AB2901。

第一作者简介:原野(1996—),男(满族),硕士研究生,研究方向为无机非金属材料制备,E-mail:yuanye2532604@163.com。

通信作者简介:秦广超(1971—),男,硕士,教授,硕士生导师,研究方向为无机非金属材料制备及工艺设计,E-mail:qingc@hfuu.edu.cn。