摘要：在乙二胺四乙酸 (EDTA) -Ag (I) -Cu (II) -H₂O体系中, 以铜粉为基体、硝酸银为银源、聚乙烯吡咯烷酮 (PVP) 为分散剂、1, 4-丁炔二醇为整平剂, 采用原位还原法制备银包覆铜粉;使用扫描电镜 (SEM) 、X射线衍射测试仪 (XRD) 、物镜球差校正场发射透射电镜 (STEM-EDS) 、同步热分析仪 (TGA) 、比表面及空隙分析仪 (BET) 等仪器对产品进行了系统表征。结果表明:银在铜粉基体上包覆成功, 且包覆层厚度达100～150 nm;产品呈分散性良好的多面体颗粒, 粒径约2.5μm;TGA检测结果表明, 银包覆层的增加提升了铜粉的抗氧化性。

关键词：原位还原法；乙二胺四乙酸（EDTA）-Ag（I）-Cu（II）-H₂O 体系；银包覆铜粉

Abstract：Using the copper powders as the substrate, the silver nitrate as the silver resource, PVP as the dispersant and 1, 4-butylene glycol as the leveling agent, silver coated copper powders were prepared by in-situ reduction method in ethylene diamine tetraacetic acid (EDTA) -Ag (I) -Cu (II) -H₂O system. The products were systematically characterized by using scanning electron microscopy (SEM) , X-ray diffraction meter (XRD) , optical lens spherical aberration correction field emission transmission electron microscopy (STEM-EDS) , simultaneous thermalanalyzer (TGA) , specific surface and void analyzer (BET) and other instruments. The results show that silver is successfully coated on copper substrate and the thickness of plating layer is about 100～150 nm. Silver coated copper powders are a kind of polyhedron granules with good dispersibility, whose particle size is about 2.5 μm. The TGA test results show that the increase of silver plating layer improves the oxidation resistance of copper powder.

Keywords：in-situ reduction method；ethylene diamine tetraacetic acid（EDTA）-Ag（I）-Cu（II）-H₂O system；silver coated copper powders