摘 要：采用化学还原法，以抗坏血酸为还原剂，油酸为分散剂，将 硝酸银溶液滴加到还原性溶液中制备电子材料用球形高纯超细银 粉。对还原机理进行了分析，探讨了还原过程中各种因素如硝酸银 溶液浓度、还原剂浓度、pH 值、搅拌方式及速率以及反应温度等对 银粉粒度大小及分布的影响。采用 TEM、SEM、EDAX 和 XRD 对所 得银粉进行了表征。结果表明，通过改变反应条件可制备 0.3~1.0 μm 的不同粒径的球形高纯超细银粉。 

关键词：电子材料；超细银粉；化学还原

Abstract: Global ultrafine silver powder was prepared by reducing the silver nitrate with ascorbic acid under the presence of oleic acid disper sant, and the reduction mechanism was analyzed. The influence of sil ver nitrate concentration, reducing agent concentration, pH value, stir ring rate and reaction temperature on diameter of silver particles and particle distribution was studied. The silver powder was characterized by TEM、SEM、EDAX and XRD. The results indicate highly pure glob al silver powder with the particle diameters between 0.3 μm and 1.0 μm could be prepared by adjusting the reaction condition. 

Keywords: electronic materials; ultrafine Ag powder; chemical reduction