摘要：为了分析高绝缘瓶级聚酯切片在固相缩聚处理阶段切片颗粒静电特性及其危害,通过实验研究不同切片颗粒静电衰减时间、单颗粒-金属滑动摩擦切片颗粒静电饱和量以及切片产品包装时料袋表面静电位。结果表明:固相缩聚处理前后瓶级切片材料的静电电荷衰减时间(半衰期)可超过80 ks;切片颗粒滑动摩擦时带负电荷,且切片单位质量携带的静电量(荷质比)可超过-1μC·kg^-1;高度带电切片可造成包装料袋表面电位超过-100 kV。瓶级切片生产过程中,应考虑消除固相缩聚装置内切片及包装成品切片携带的静电荷,抑制静电对粉尘吸附作用,以有效控制切片中粉尘含量,提高切片产品质量。

关键词：瓶级聚酯切片；固相缩聚；粉尘；静电衰减；静电吸附

Abstract: In order to analyze the electrostatic characteristics and the hazards of the high-insulation bottle-grade polyester chips during the solid-state polycondensation ( SSP) process，the electrostatic attenuation characteristics of the particles，the static saturation of the single particle－metal sliding friction chip particles and the electrostatic characteristics of the bottle-grade chips in the sliding process were experimentally studied． The electrostatic potential of the surface of the bag during the packaging of the sliced products was measured． The results showed that the electrostatic charge decay time ( half-life) of bottle-grade polyester chips can exceed 80 ks during the SSP process． All particles are negatively charged and the charge-mass ratio of a single grain in the sliding process exceeded －1 μC/kg． In the actual production process， the surface potential of the packaging bag exceeded －100 kV． Consideration should be given to eliminating static electricity of the polyester chips during the SSP processs and packaging process to suppress the electrostatic adsorption of dust，and improving the quality of the polyester chips． 

Keywords: bottle-grade PET chip; solid-state polymerization; dust; static decay; electrostatic adsorption